KLA P-170 Fully automatic probe surface profilometer
Product Introduction of KLA P-170 Fully Automatic Probe Surface Profilometer:
KLA P-170 Fully automatic probe surface profilometerA box-to-box step measuring instrument, featuringKLA P-17 probe-type surface profilometerThe desktop system's measurement performance and the HRP260 system's production-verified processing procedures. This system offers a programmable scanning platform, low noise and sub-Anglen electronic resolution throughout the entire vertical range, enabling high-resolution scanning anywhere on the sample surface.
The formula setup of the KLA P-170 system is fast and simple, featuring click-based platform control, dual-view optics and high-resolution digital cameras. Place the cursor on a specific feature and achieve fully automated measurement through automatic wafer processing, pattern recognition, sorting, and feature detection.KLA P-170 Fully automatic probe surface profilometerIt includes automatic data analysis, step height of up to 30 steps in a single scan, surface roughness, histogram step height, CMP analysis, and a set of extended analysis algorithms using Apex advanced data analysis software. Advanced geometric shape recognition algorithms and calibration for X-Y and Z-axis matching enhance the transportability of formulas between systems, which is a key requirement in a 24x7 production environment.
Product features of KLA P-170 Fully automatic probe-type Surface profilometer:
Step height: A few nanometers to 1000μm
Micro-force constant force control: 0.03 to 50mg
Full-diameter scanning of the sample is required without image stitching
Video: 5-megapixel high-resolution color camera
Arc correction: Clear the errors caused by the arc-shaped movement of the probe
Production capacity: Fully automated through sequencing, pattern recognition and SECS/GEM
Wafer mechanical transfer arm: Automatically loads opaque (such as silicon) and transparent (such as sapphire) samples ranging from 75mm to 200mm
Measurement principle of KLA P-170 Fully automatic probe surface profilometer:
KLA P-7 probe-type step gaugeThe LVDC sensor technology is adopted. The LVDC sensor tracks the surface terrain by utilizing changes in capacitance. The capacitance change is caused by the movement of a thin metal sensor blade moving between two capacitive plates. When the probe tracks the surface, the position of the sensor blade changes, which causes a change in capacitance. Then, the capacitance change is converted into a terrain signal. The advantage of LVDC design is its small mass and linear motion of the blades, thereby reducing hysteresis and friction to a very low level. This design enables precise, stable and high-resolution measurements throughout the entire vertical range.
The main applications of KLA P-170 fully automatic probe-type surface profilometer:
Fully automatic industrial measurement | Measurement of thin film/thick film steps and etching depth |
Photoresist/photoresist step | Flexible film |
Characterization of surface roughness/flatness | Surface curvature analysis |
2D/3D stress measurement of thin films | Surface 3D contour imaging and structural analysis |
Defect characterization and defect analysis | Roll-off measurement |
Other multiple surface analysis functions |
Product application of KLA P-170 Fully automatic probe Surface profilometer:
Step height
Based on the dynamic range of the sensor combination, measure the height of two-dimensional and three-dimensional steps from nanometers to 1mm. Quantify the materials deposited or removed in etching, sputtering, SIMS, deposition, spin coating, CMP and other processes.
Texture: Roughness and waviness
Measure two-dimensional and three-dimensional textures, and simultaneously quantify the roughness and waviness of the sample. The roughness and ripple components are discriminated by using software filters, and parameters such as root mean square roughness are calculated.
Form: Bow and shape
Measure the 2D shape or bow of the surface, including the wafer bow resulting from layer stress mismatch during device manufacturing, such as in the production of semiconductor or composite semiconductor devices with multi-layer deposition. Measure the height and radius of curved surface structures, such as lenses.
Thin film stress
Measure the 2D and 3D stresses caused during the manufacturing process of semiconductor or compound semiconductor devices with multiple process layers. The 2D stress mode uses a single scan across the sample diameter, while the 3D stress mode rotates θ steps between 2D scans to measure the entire sample surface.
Defect detection
Measure the terrain of the defect, such as the depth of the scratch. Import KLARF position coordinates from the defect inspection tool to automatically navigate to a specific defect. Use the defect review procedure to select individual defects for two-dimensional or three-dimensional measurement.
Industry application of KLA P-170 Fully automatic probe Surface profilometer:
Semiconductors and composite semiconductors
Measure the surface topography from the front end to the back end and during the packaging process. These applications include the measurement of photoresist thickness, etching depth, sputtering height, post-CMP morphology, roughness, sample bending and stress. Optimize measurement accuracy by using pattern recognition and automatic analysis to improve production process control.
LED and power devices
Measure the step height of the patterning process, including the MESA step height, ITO step height and contact depth. Measure substrate rolling off, bending, epitaxial roughness and epitaxial film stress that may cause cracks and defects. Use a defect review application to distinguish between nuisance and fatal defects.
MEMS and optoelectronics
Measure the step height, radius of curvature and 3D terrain of macroscopic and microscopic lenses. Measure the depth and surface roughness of waveguide and dense wavelength division multiplexing (DWDM) structures.
Data storage
Describe the characteristics of thin-film head chips and sliders, hard disks, optical and magnetic media. Chip applications include electroplating thickness, coil height and CMP flatness. Slider applications include polarity dent analysis, air bearing cavity measurement and laser texture bump characterization, including bump height, width and depth analysis.
"5G Application"
Measure the terrain and step heights of various devices after etching, before CMP and after CMP. By taking advantage of the production function of the KLA P-170 fully automatic probe-type surface profilometer, multiple parts on the wafer are automatically measured to enhance the quality control of the critical layer and improve the reliability of the device.
Hardware features of KLA P-170 Fully automatic probe surface profilometer:
Probe option
KLA P-170 Fully automatic probe surface profilometerA variety of probes are provided to support the measurement of step height, aspect ratio step size, roughness, sample bow shape and stress. The tip radius range of 40nm to 50μm determines the lateral resolution of the measurement. The included angles range from 20 to 100 degrees, which determine the maximum aspect ratio of the measured features. All probes are made of diamond to reduce probe wear and extend probe life.
Sample chuck
The KLA P-170 step meter system has a series of chucks to choose from to support multiple applications. The standard is a vacuum chuck that supports the measurement of samples ranging from 75 to 200 millimeters. The stress chuck is equipped with 3-point positioners, supporting accurate bow-shaped measurement of the sample at a neutral position. In addition, there are options for processing bow-shaped wafer samples.
Processing program options
The KLA P-170 step meter system includes a aligner for opaque wafers (such as GaAs) and a box-type workstation for 200mm wafers. Options include transparent sample aligners (such as sapphire), smaller sample sizes ranging from 75mm to 150mm, a second box station, a box slot mapper, a signal tower and an ionizer.
Isolation desk
The KLA P-170 step meter system is equipped with an independent isolation platform and uses an air isolator to provide passive isolation. This custom isolation console meets the ergonomic requirements of SEMIS8, placing the keyboard, mouse, monitor and a box workstation at the correct ergonomic height. The keyboard, mouse, computer and monitor are on a separate component to isolate the noise during the measurement of the KLA P-170 step meter system.
Standard for step height
The KLA P-170 step gauge system uses the NIST-traceable step height standards for thin films and thick films provided by VLSI Standards. These standards have oxide steps on silicon wafers installed on quartz blocks, or etched quartz steps with a chromium coating. The available step height standards range from 8 nanometers to 250 microns, and the wafer mounting standards can also be used in conjunction with the processor.
Product parameters of KLA P-170 Fully automatic probe Surface profilometer:
Repeatability | 4 a (0.10%) | Vertical resolution | 0.01 A | Maximum measured length | 200mm |
Needle pressure range | 0.03 ~ 50 mg | Horizontal resolution (X) : | 0.025 (including m | Horizontal resolution (Y) : | 0.5 (including m |
Scanning speed | 2μm/s-25mm/s | Vertical linearity | Plus or minus 0.5% & gt; 2000 a10a 2000 a or less |
For more parameters, please contact us |
Measurement diagram of KLA P-170 Fully automatic probe surface profilometer:
