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Conference Preview: 2024 Semiconductor Advanced Technology Innovation Development and Opportunities Conference

2025-09-02 15:23:22 admin

Seize the opportunity and forge ahead with unity. The 2024- Semiconductor Advanced Technology Innovation Development and Opportunities Conference will be organized and held at the Shishan International Conference Center in Suzhou on May 22-23, 2024.

This conference will be held simultaneously in the form of two forums, namely "CHIP China Crystal Chip Seminar" and "Advanced Technology and Application Conference of Compound Semiconductors". The conference includes: semiconductor manufacturing and packaging, compound semiconductor materials and preparation processes, power devices and application technologies. Launch high-level dialogues on the broad semiconductor industry to promote the exchange of information and cooperation among participants.

Li Yang, the general manager of Unicom Technology Co., LTD., will deliver a special report at this conference and discuss various measurement technologies in the field of compound semiconductors with you.

05.22

Venue B - Power Electronic Devices and Applications

16:00

Analysis and Selection of Multiple Measurement Techniques in Compound Semiconductors - Li Yang

Scan the QR code above to register for the conference

The time is up to May 21st

Please register in advance to attend

This meeting is a paid one. For details, please consult the organizer

Exhibition equipment


F50 Film thickness Measuring instrument
The F50 can be simply straightenedThickness distribution map of the sample film with a diameter of 450 millimeters. The r-θ polar coordinate moving platform is adoptedIt can quickly locate the required test points and obtain the test thickness in real time, approximatelyTest two points per second.
Related applicationsSemiconductor manufacturing (photoresist, oxides/nitrides /SOI, wafer backside grinding); LCD liquid crystal display (polyimide, ITO transparent conductive film); Optical coating (hard coating, anti-reflection layer); MEMS micro-electromechanical systems (photoresist, silicon-based film layers).


Profilm3D White Light Interference Optical Profilometer
Profilm3D employs vertical interference scanning (WLI) and high-precision phase interference (PSI) technology. Achieve sub-nanometer surface morphology research with strong cost performance.
Related applicationsRoughness measurement Three-dimensional topography characterization Measurement of step height